Parameters

Layers:    18L (4R+10F+4R)

Thicknes:    2.1±0.02mm

Size:    287.88*421.05mm

Min. Distance Between Line and Width:    0.2mm/0.2m

Min. Buried Via/PAD:    0.4mm/1.0mm

Min. Distance from Via to Line:    0.3mm

Thickness:  Surface Copper≥35um; Min. Hole Copper:  30um;  Average: 35um

Impedance:    50±10%

Surface Treatment:  ENIG

Crafts

ARLON PI Material Special Control during Lamination

Impedance Control

Mechanical Depth Routing Control

Protecting Adhesive Covering Connection Conner between Flex and Rigid Tech

Laser Depth Cutting Control

Applications

Mother Board of Aerial Tanker Control System