Products
8 Layers Micro-via Stack up
Category: HDI
Publish Time: 2015-11-26 00:00
Parameters
Layers: 8
Thicknes: 1.2±0.12mm
Min. Hole Size: Via/0.3mm
Parameters
Layers: 8
Thicknes: 1.2±0.12mm
Min. Hole Size: Via/0.3mm
Blind Via/0.15mm
Width/Space: 0.1mm/0.1mm
Surface Treatment: Immersion Au
Crafts
Micro-via Stack up
Applications
Mobile Phone, Tablet